Interchangeable pressure sensor assembly and methods of assembly

ABSTRACT

The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a sensor unit subassembly for installation in or use with a pressure sensor housing may include at least one pressure sensor signal output terminal supported by a printed circuit board, a pressure input port, and a pressure sense element secured relative to one or more printed circuit boards. The printed circuit board(s) may include circuitry configured to format pressure output signals provided by the pressure sense element into a particularly chosen output format, and may provide the formatted pressure output signal(s) to an attached electrical connector of the pressure sensor housing. In some cases, the sensor unit subassemblies can be mixed with a multitude of different electrical connectors and/or with a multitude of different port connections to from a wide array of pressure sensor assemblies.

This application is a continuation of U.S. patent application Ser. No.13/195,815, filed Aug. 1, 2011, entitled. “INTERCHANGEABLE PRESSURESENSOR ASSEMBLY AND METHODS OF ASSEMBLY,” which is incorporated hereinby reference.

TECHNICAL FIELD

The present disclosure relates generally to sensors, and moreparticularly to sensor assembly structures.

BACKGROUND

Sensors are commonly used today to sense environmental parameters suchas temperature, humidity, pressure, flow, thermal conductivity, gasconcentration, light, magnetic fields, electric fields, as well as manyother environmental parameters. Such sensors are used in a wide varietyof applications including, for example, medical applications, flightcontrol applications, industrial process applications, combustioncontrol applications, weather monitoring applications, water meteringapplications, as well as many other applications.

SUMMARY

This disclosure is directed to several alternative designs, materialsand methods of manufacturing electrically responsive sensor assemblies.Although sensor assemblies are known to exist, there is need forimprovement to such sensor assemblies.

Accordingly, one illustrative aspect of the disclosure includes apressure sensor unit subassembly for installation into a pressure sensorhousing having a pressure port with a fluid path extending therethrough,an electrical connector including a mechanical connector and at leasttwo electrical terminals, and an outer housing extending between thepressure port and the electrical connector. The pressure sensorsubassembly may include at least one pressure signal output terminalsupported by a second printed circuit board that may be configured to beelectrically connect to at least one of the electrical terminals, apressure input port configured to be aligned with the fluid path of thepressure port, a pressure sense element supported by a first printedcircuit board for sensing a pressure presented at the pressure inputport and for providing at least one electrical pressure output signal.Further, the second printed circuit board may include circuitry that maybe configured to format at least one pressure signal provided by thepressure sense element into a particular output format and to providethe formatted at least one pressure output signal to at least oneselected electrical terminal.

In some instances, there may be multiple pressure sensor unitsubassemblies from which to choose from for installation into a pressuresensor housing. Each of the multiple pressure sensor unit subassembliesmay include circuitry to format the at least one pressure output signalinto an output format different from at least one formatted outputsignal of another pressure sensor unit subassembly.

In some instances, there may be a plurality of pressure ports from whichto choose from for use in the pressure sensor housing. Each of theplurality of pressure ports may have a fluid opening that may bepositioned at a common location among the plurality of pressure portsand a geometric shape and/or size of an external side that may bedifferent from at least one external side of another of the plurality ofpressure ports.

In some instances, there may be a plurality of electrical connectorsfrom which to choose from for use in the pressure sensor housing. Eachof the plurality of electrical connectors may have at least twoelectrical terminals that are positioned at common locations across allof the plurality of electrical connectors and a geometric shape and/orsize of a second end that may be different from at least one second endof another of the plurality of electrical connectors.

The preceding summary is provided to facilitate an understanding of someof the innovative features unique to the present disclosure and is notintended to be a full description. A full appreciation of the disclosurecan be gained by taking the entire specification, claims, drawings, andabstract as a whole.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure may be more completely understood in consideration of thefollowing description of various illustrative embodiments of thedisclosure in connection with the accompanying drawings, in which:

FIG. 1 is a perspective view of an illustrative sensor assembly andcable harness;

FIG. 2 is a schematic cross-sectional view of the illustrative sensorassembly and cable harness of FIG. 1;

FIG. 3 is a perspective view of an illustrative sensor assembly;

FIG. 4 is an exploded perspective view of the illustrative sensorassembly of FIG. 3;

FIG. 5 is a schematic cross-sectional view of the illustrative sensorassembly of FIG. 3;

FIGS. 6A-6C are cross-sectional views of alternative illustrativeconnection features between a port and a carrier of an illustrativesensor assembly;

FIG. 7 is a perspective view of an illustrative sensor subassembly;

FIG. 8 is an exploded perspective view of the illustrative sensorsubassembly of FIG. 7;

FIG. 9 is a top view of the illustrative subassembly of FIG. 7;

FIG. 10 is a bottom view of the illustrative subassembly of FIG. 7;

FIG. 11 a top perspective view of an illustrative protective cover ofthe illustrative subassembly of FIG. 7;

FIG. 12 is a bottom perspective view of the illustrative protectivecover of FIG. 11;

FIG. 13 is a flow diagram showing steps of an illustrative fabricationprocess for an illustrative electrical connector/housing subassembly;

FIGS. 14A and 14B are top and bottom views, respectively, of theassembled illustrative electrical connector/housing subassembly of FIG.13.

FIGS. 15A and 15B are perspective and exploded perspective views,respectively, of an illustrative sensor/port subassembly;

FIG. 16 is a bottom view of the port of the illustrative sensor/portsubassembly of FIG. 15A;

FIG. 17 is a top view of the port of the illustrative sensor/portsubassembly of FIG. 16;

FIG. 18 is a partial exploded perspective view of an illustrative sensorassembly;

FIG. 19 is a top view of an illustrative cable cover of the illustrativecable harness of FIG. 1;

FIG. 20 is a bottom view of the illustrative cable cover of FIG. 19;

FIG. 21 is a bottom perspective view of the illustrative cable cover ofFIG. 19;

FIG. 22 is a partial top perspective view of the illustrative cableharness of FIG. 1; and

FIG. 23 is a partial top perspective view of the illustrative sensorassembly and cable harness of FIG. 1.

FIG. 24 is a flowchart of a method of assembling a pressure sensor.

While the disclosure is amenable to various modifications andalternative forms, specifics thereof have been shown by way of examplein the drawings and will be described in detail. It should beunderstood, however, that the intention is not to limit aspects of thedisclosure to the particular embodiments described herein. On thecontrary, the intention is to cover all modifications, equivalents, andalternatives falling within the spirit and scope of the disclosure.

DESCRIPTION

The following description should be read with reference to the drawingswherein like reference numerals indicate like elements throughout theseveral views. The description and drawings show several embodimentswhich are meant to be illustrative of the disclosure.

Referring to the Figures, and in one illustrative embodiment, a sensorassembly 10 may include a sensor unit 20, pressure port 110, anelectrical connector 120 and an outer housing 130, as depicted in FIGS.1-5. In some instances, pressure port 110 may be mechanically connectedto sensor unit 20, and at a first end 120 a, electrical connector 120may be mechanically and electrically connected to sensor unit 20, and ata second end 120 b, electrical connector 120 may mechanically andelectrically connect to a cable harness 160, as best seen in FIGS. 1 and2. It is contemplated that sensor assembly 10 may be any suitable typeof sensor assembly. For example, sensor assembly 10 may be a pressuresensor assembly, a humidity sensor assembly, a force sensor assembly, apressure switch assembly, a light sensor assembly, a gas concentrationsensor assembly, a magnetic or electrical field sensor assembly, aconductivity sensor assembly, or another other suitable sensor assembly.

In some instances, parts of sensor assembly 10 may be assembled intovarious subassemblies, as discussed further herein. For example, asensor housing subassembly 12, as seen in for example FIG. 18, mayinclude pressure port 110, electrical connector 120 and an outer housing130, among other features; a connector subassembly 14, as best seen inFIGS. 4 and 13, may include outer housing 130 and electrical connector120, among other features; a pressure sensor subassembly 16 may includesensor unit 20 with a carrier 32 and pressure sensor 50, and pressureport 110, among other features; and a further sub-assembly, as best seenin FIGS. 7-10, which may be installed into sensor housing 12, mayinclude sensor unit 20, among other features.

Sensor Unit

Generally, a pressure sensor unit subassembly or sensor unit 20, as seenin the illustrative embodiment of FIGS. 7-10, may include one or moreelectrical terminals 92, a carrier 32, a pressure sensor 50 including asense element 52, a first printed circuit board (a “PCB”) 60 that may atleast partially define a second side 20 b of the sensor unit subassembly20, a second PCB 70 that may at least partially define first side 20 aof the sensor unit sub-assembly 20, and a cover 90, among otherfeatures. When assembling sensor unit 20, cover 90 may be positionedbetween first PCB 60 and second PCB 70, as seen in FIG. 8, or at anotherdesirable location capable of facilitating and maintaining a spacebetween first PCB 60 and second PCB 70.

In some cases, sensor unit 20 may illustratively include pressure sensor50 having pressure sense element 52 for measuring pressure of a fluidapplied at pressure input port 22 and traveling through fluid path 34,where sense element 52 may provide one or more electrical pressuresignals in response to sensing the pressure of the fluid applied atpressure input port 22 (e.g., see FIG. 5). In some cases, pressuresensor 50 including sense element 52 may be secured to first side 32 aof carrier 32 in any manner. For example, pressure sensor 50 may besecured to carrier 32 through the use of an attach or an adhesive orthrough another desirable connection technique such that pressure senseelement 52 may be in fluid communication with fluid path 34 extendingthrough carrier 32 (as depicted in FIG. 5). It is contemplated that anysuitable adhesive or attaching material may be utilized for connectingpressure sensor 50 to carrier 32 that facilitates allowing sense element52 to maintain its connection to carrier 32 while not transferring aninordinate amount of stress to the sense element 52 when pressure isapplied thereto.

Carrier 32 of sensor unit 20 may have a first side or end 32 a and asecond side or end 32 b having an opening extending from first side 32 ato second side 32 b, as best seen in FIGS. 5 and 10. Opening 44 may beat least partially defined by carrier 32 and opening 44 may create acarrier fluid path 34 that travels at least from an input port 22 tosense element 52 abutting or adjacent to opening 44 at first side 32 a.Input port 22 may be located at or near second side 32 b (e.g., an endof carrier 32 of sensor unit 20 that abuts or is connected to or is incommunication with pressure port 110 and through which fluid path 34 maytravel from pressure port 110 to sensor unit 20) having end face 33. Asmentioned, sense element 52 may be positioned at or near first side 32a, which may be located at a side of carrier 32 substantially oppositesecond side 32 b. End face 33 of carrier 32 may be at leastsubstantially flat (e.g., at least substantially planar), as shown inFIG. 6A, or end face 33 may have a recess 37 therein defined by a bottomwall 39 and side walls 40, where bottom wall 39 may abut or intersectfluid path 34 and may be at least substantially flat (e.g., at leastsubstantially planar) and non-coplanar with end face 33, as depicted inFIG. 6B. Alternatively, or in addition, second end 32 b of carrier 32may include a second shoulder 41 (a first shoulder 38 is discussedbelow) with a protrusion 43, where protrusion 43 may extend around fluidpath 34 and may define at least part of fluid path 34, as seen in FIG.6C. Moreover, protrusion 43 may be at least partially defined by fluidpath 34 and side walls 35.

In some instances, carrier 32 of sensor unit 20 may include an alignmentfeature 46 for aligning carrier 32 with first PCB 60, as best seen inFIG. 8. For example, alignment feature 46 may be a shape of a part of aportion of carrier 32 that may engage first PCB 60. In the exampleshown, the shape of the part of the portion of carrier 32 engaging firstPCB 60 may be rounded or have a curve while the remaining parts of theportion of carrier 32 engaging first PCB 60 have a different shape(e.g., a flat or straight shape), as best seen in FIG. 8. Alternatively,alignment feature 46 may include a flat part of the portion of carrier32 engaging first PCB 60 while the other parts are rounded. Further,first PCB 60 may have an alignment feature 67 (e.g. aperture)corresponding to alignment feature 46 of carrier 32. Additionally, oralternatively, any other suitable alignment features may be used foraligning carrier 32 with first PCB 60, when so provided.

Carrier 32 of pressure sensor subassembly 16 may be formed variousshapes or configurations. In an illustrative example, second end 32 b ofcarrier 32 may have various shapes or configurations; for example,second end 32 b may be planar, may have one or more recess or may haveone or more protrusion or may take on other geometric shapes, sizes andconfigurations. The shapes and configurations of second end 32 b may besuch that second end 32 b may be configured to engage or connect to aninternal side 114 or end of pressure port 110. For example, second end32 b of carrier 32 may have an end face 33 and side walls 35, such thatsecond end 32 b of carrier 32 may extend into a recess 115 of pressureport 110. Such configurations may form a butt joint, a tube joint, ahole joint or other type of joint between carrier 32 and pressure port110.

Further, carrier 32 may be made of any type of material. For example,carrier 32 may be made of a ceramic material or any other suitablematerial. In addition, and in some cases, at least a portion of end face33 and/or bottom wall 39 may have a textured surface or non-texturedsurface, where a textured surface may facilitate adhering carrier 32 topressure port 110. The textured surface may be formed using any suitabletechnique including, for example, one or more of an abrasive etch, gritblasting, a chemical etch, a laser etch, machining or other similar ordifferent texturing technique.

In some instances, sensor unit 20 may include at least one printedcircuit board (PCB). For example, sensor unit 20 may include a first PCB60 and a second PCB 70, but this is not required in all embodiments.First PCB 60 may have a first side 60 a and a second side 60 b and ahole or opening 61 extending from first side 60 a to second side 60 b.Opening 61 may be any shape or size. For example, opening 61 may be ashape and size capable of receiving carrier 32 such that carrier 32abuts an interior perimeter 63 of opening 61, or opening 61 may have anyother desirable configuration consistent with the features of pressuresensor assembly 10. In some cases, first PCB 60 may include variouselectronic components and/or circuitry. For example, first PCB 60 mayinclude an application specific integrated circuit (ASIC), acompensation circuit 62, and/or other electronic component(s). In oneexample, first side 60 a of first PCB 60 may include compensationcircuit 62 that may be electrically coupled to an output of the pressuresensor 50 for providing a compensated pressure sensor output signal,and/or first side 60 a may include any other suitable circuitry.Further, with respect to the structural relationship of the otherfeatures of sensor unit 20, second PCB 70 may be vertically positionedor spaced above or from first PCB 60, as best seen in FIG. 8.

Referring to FIG. 8, lower PCB 60 may be connected to carrier 32 and theconnection may be formed by any suitable connection technique. Forexample, first PCB 60 may connect to carrier 32 in a manner that allowsfirst side 32 a of carrier 32 and sense element 52 to extend throughopening 61, such that pressure sense element 52 may be positionedadjacent first side 60 a of first PCB 60, and a first shoulder 38 ofcarrier 32 may be positioned adjacent second side 60 b of first PCB 60.Sense element 52 may be positioned adjacent first side 60 a of first PCB60 to facilitate wire bonding sense element 52 to first side 60 a or itmay be so positioned for another purpose. Further, first shoulder 38 maybe permanently or semi-permanently connected to second side 60 b offirst PCB 60 through the use of a first PCB attach or adhesive or glue,or through any other suitable connection or adhering technique.

Second, upper PCB 70 may have a first side 70 a and a second side 70 b,where first side 70 a may have one or more electro-mechanical clips 76.For example, one or more electro-mechanical clips 76 may be capable ofengaging one or more electro-mechanical clip 84 of a third PCB 80 (e.g.,see FIG. 2). Further, first side 70 a of second PCB 70 may support aground terminal 28, a power terminal 26, one or more pressure sensoroutput terminal 30 and one or more test pad (not shown) on or near firstside 20 a of sensor unit subassembly 20, as best seen in FIGS. 15A and15B.

In some instances, first PCB 60 and/or second PCB 70 may includecircuitry that may be configured to format the one or more pressureoutput signals provided by pressure sense element 52 into a particularoutput format. For example, circuitry of first PCB 60 and/or second PCB70 (e.g., all of the circuitry may be on first PCB 60 or all of thecircuitry may be on second PCB 70 or the circuitry may be on first PCB60 and/or second PCB 70) may be configured to format the one or morethan one pressure output signal provided by pressure sense element 52into a ratio-metric output format, a current format, a digital outputformat and/or any other suitable format. In some cases, the circuitry offirst PCB 60 and/or second PCB 70 may be configured to regulate anoutput voltage. Circuitry on first PCB 60 and/or second PCB 70 forproviding a ratio-metric (or other) output may include traces and/orother circuitry that may serve as a conduit to test pads on the firstside 70 a of second PCB 70, and/or for providing the ratio-metric (orother) output to electrical connector 120, where the circuitry does notnecessary reformat the output.

When a particular sensor unit 20 is selected to be installed in sensorhousing 12, first PCB 60 and/or second PCB 70 may provide a formattedone or more pressure output signal (e.g., formatted into a first outputformat and/or a second output format that may be different than thefirst output format) to one or more selected electrical terminals 122 ofelectrical connector 120 via an electrical connection with one or morepressure signal output terminals 30. The circuitry on first PCB 60and/or second PCB 70 may be configured to format the one or morepressure signals provided by pressure sense element 52 into multiplevoltage or current formats. In addition, circuitry on first PCB 60and/or second PCB 70 may be configured to regulate a power supplyvoltage incoming from electrical connector 120 prior to or beforeproviding the regulated voltage to power pressure sense element 52.

In some instances, sensor unit 20 may include a cover 90, as best seenin FIGS. 11 and 12. Cover 90 may be positioned within sensor unit 20between first PCB 60 and second PCB 70, as best seen in FIGS. 7-8. Cover90 may be positioned such that it may act to maintain a mechanicalspacing between first PCB 60 and second PCB 70, or cover 90 may be usedfor any other similar or different purpose. Cover 90 may have a body 91having a first, upper side 91 a and second, lower side 91 b, where upperside 91 a may be configured to contact or engage second PCB 70 at one ormore locations and lower side 91 b may be configured to contact orengage first PCB 60 at one or more locations. Further, and in someinstances, body 91 may have a perimeter portion 93 that extends around aportion (e.g., a quarter, a half, at least a majority, etc.) of firstPCB 60 and extends around a portion (e.g., a quarter, a half, at least amajority, etc.) of second PCB 70. Body 91 may be generally electricallyinsulating, but may include one or more electrical terminals 92 that maybe capable of transmitting one or more electrical signal between firstPCB 60 and second PCB 70. Electrical terminals 92 may be any electricalterminal configured to transmit one or more electrical signal betweenfirst PCB 60 and second PCB 70. For example, electrical terminals 92 mayinclude compliant pins 94, which are discussed in greater depth in U.S.Pat. No. 7,458,274, issued on Dec. 2, 2008 to Lamb et al. and titledPRESSURE SENSOR INCORPORATING A COMPLIANT PIN, which is hereby fullyincorporated by reference. Compliant pins 94 may be supported by body 91(e.g., insert molded in body 91 or supported in another manner), as seenin FIGS. 11 and 12, and may extend into electrically conductivecorresponding holes 64, 72 on first PCB 60 and second PCB 70,respectively. Compliant pins 94 may form electrical and mechanicalconnections with first PCB 60 and second PCB 70, as best seen in FIGS.6-8. In some cases, compliant pins 94 may be the sole (e.g., only)mechanical mechanism that secures first PCB 60 to second PCB 70.

Cover 90 of sensor unit 20 may include body 91 having first side 91 a(e.g., upper side) facing second side 70 b of second PCB 70 and secondside 91 b (e.g., lower side) facing first side 60 a of first PCB 60(e.g., lower PCB), where one or more support features 96 may extend fromat least second side 91 b toward first PCB 60. Support features 96 mayextend from second side 91 b in any configuration and may providesupport for first PCB 60 by spreading or dispersing out the force loadwhile a fluid force is applied to pressure sensor 50 (e.g. withoutpressure port 110 connected). For example, support features 96 mayextend from second side 91 b in a manner such that support features 96may be capable of at least partially contacting first side 60 a of firstPCB 60 and may be capable of extending across a portion (e.g., aquarter, a half, a majority, at least a majority, etc.) of first side 60a of first PCB 60. Further, support features 96 may contact first PCB 60in such a manner so as to apply or transmit a force from second side 91b of body 91 to first PCB 60. It is contemplated that the force fromsecond side 91 b may be at least sufficiently large to hold pressureinlet/input port 22 of pressure sensor 50 on a pressure source exertingpressure at a level of pounds per square inch (PSI) of ten (10) PSI orany other PSI including, but not limited to, 1, 2, 4, 8, 10, 20, 40, 50,100, 1000, 2000, 5000 PSI or more, for example, without effecting theaccuracy of the output of the pressure sensor by more than 0.01 percent,0.1 percent, 1 percent, 5 percent, 10 percent or more, as desired.

Support features 96 may include a first support feature 98, and a secondsupport feature 100 that may be spaced (e.g., laterally spaced) from oneanother by a gap 102, as best seen in FIG. 12. Gap 102 may be configuredto receive pressure sensor 50 and have pressure sensor 50 situatedtherein when cover 90 has been applied to first PCB 60, where cover 90may provide mechanical protection from large, gross objects, or otherobjects, that may otherwise strike wire bonds 56 connecting sensor 50 tofirst PCB 60 and other devices interior to cover 90. Support features 96may abut first side 60 a along a substantial entirety of their path, orsupport features 96 may abut or contact first side 60 a at two or moreplaces using contacts 97 of support features 96. Further, supportfeatures 96 may also include a perimeter support feature 101. Further,support features 96, 101 may at least partially define one or moreopenings or vents 104 in cover 90. Openings 104 may be utilized for anypurpose, including but not limited to, allowing air to flow betweenfirst PCB 60 and second PCB 70 and to pressure sensor 50.

As second side 91 b of body 91 of cover 90 may be configured or shapedto distribute forces that may be applied to first PCB 60 via supportfeatures 96 across first PCB 60, first PCB 60 may remain sufficientlyflat and cause less than a particular percentage error in the output ofpressure sensor 50 when cover 90 is applied to first side 60 a and apressure is applied to pressure sensor 50 (e.g. without a pressure port110 attached to the carrier). The particular percentage error may be ten(10) percent (%) or less error in the output of pressure sensor 50, oranother desirable limit on error including, but not limited to less than0.001%, 0.01%, 0.1%, 1.0%, 2.0%, 5.0%, 10.0%, 20.0% or another level oferror.

Sensor unit 20 may also include one or more PCB alignment features 99capable of aligning cover 90 with first PCB 60 and/or second PCB 70. PCBalignment feature of cover 90 may extend from sides 91 a, 91 b of body91 and engage or contact respective first and second PCBs 60, 70. PCBalignment features 99 may engage corresponding cover alignment features65, 75 which may be within a perimeter 66, 74 of first and second PCBs60, 70, respectively.

In some instances, sensor unit 20 may include at least one exterioralignment feature 95 capable of engaging a first alignment feature 150of outer housing 130 to align sensor unit 20 with outer housing 130,where outer housing 130 may or may not be part of a parent pressuresensor subassembly 16. Exterior alignment feature 95 of sensor unit 20may be positioned on or near an exterior of cover 90; for example,exterior alignment feature 95 may be positioned on an exterior of cover90, as best seen in FIG. 4. First alignment feature 150 of outer housing130 may be positioned to engage or contact exterior alignment feature 95of sensor unit 20 from an interior 131 of outer housing 130, also bestshown in FIG. 4.

Sensor unit 20 may be formed or put together through the use of anysuitable technique. For example, a carrier 32 may be provided and dieattach 54 (e.g., glue or adhesive) may be applied to a top or first side32 a of carrier 32. After die attach 54 or other connection facilitatingsystem has been applied to carrier 32, sense die or element 52 ofpressure sensor 50 may be positioned on die attach 54 and then cured (ifnecessary) to make a permanent or semi-permanent connectiontherebetween. Once sense element 52 has been connected to carrier 32,first PCB attach 68 (e.g., glue or adhesive) or other connectionfacilitating system may be applied to first shoulder 38 of carrier 32and first PCB 60 may be positioned on first shoulder 38 and cured (ifnecessary) in place. First PCB 60 may be connected to carrier 32 in anya manner. For example, second side 60 b may be positioned on first PCBattach 68 on carrier 32 and accordingly, sensor element 52 and carrier32 may be inserted through opening 61 so as to be adjacent first side 60a. After first PCB 60 has been placed on first PCB attach 68, first PCBattach 68 has been cured and first PCB 60 has been permanently orsemi-permanently attached to carrier 32, sense element 52 may beconnected to first side 60 a in any electrically conductive manner. Forexample, bond pads of sense element 52 may be connected to bond pads onthe first side 60 a via wire bonding or any other similar or differenttechnique. For example, two or more wire bonds 56 may be used to bondfirst side 60 a of first PCB 60 to sense element 52. Wire bonds 56 maybe free from contact with cover 90 while cover 90 engages first side 60a of first PCB 60. Cover 90 may engage electrically conductive holes 64of first PCB 60 through compliant pins 94 extending from cover 90 towardfirst PCB 60. Further, electrically conductive holes 72 of second PCB 70may engage cover 90 through compliant pins 94 extending from cover 90toward second PCB 70. Once second PCB 70 has been electrically andmechanically connected to cover 90 and first PCB 60 through compliantpins 94, a sensor unit subassembly 20 may have been formed.

The structural relationships of features of sensor unit 20 describedherein may be illustrative examples of embodiments and the structure maybe organized in other relatively similar and advantageous manners thatmay allow sensor unit 20 to sense a pressure presented at pressure inputport 22 and provide one or more pressure output signal on one or morepressure signal output terminals 30 electrically connected to electricalterminals 122 of electrical connector 120 when sensor unit 20 isinstalled within sensor housing 12, as best seen in FIGS. 2 and 5.Further, sensor unit 20 may be a subassembly as described or it may beconsidered a stand alone sensor capable of operating on its own or inanother assembly, as sensor unit 20 may be considered a sensor capableof sensing and/or receiving a temperature, humidity, pressure, flow,thermal conductivity, gas concentration, light, magnetic fields,electric fields, as well as many other environmental parameters andproviding an output proportional to or otherwise related to a presenceof the condition or parameter being measured. In addition, sensor 20 maytake on other configurations not explicitly discussed herein. Forexample, sensor 20 may have a differently configured pressure sensor 50or sense element 52, such as a sensor having an oil-filled metaldiaphragm or other design.

Pressure Port

Pressure sensor assembly 10 may have pressure port 110 configured to beassembled with sensor unit 20, where pressure port 110 may at leastpartially define fluid path 116 extending from an external side 112(e.g., a second side) of pressure port 110 to an internal side 114(e.g., a first side) of pressure port 110, as best seen in FIGS. 15-17.Second side 32 b of carrier 32 may be secured to pressure port 110 withrespect to internal side 114, and fluid path 116 may align with fluidpath 34 of carrier 32 such that fluid path 116 is in communication withfluid path 34.

In some instances, internal side 114 of pressure port 110 may have arecess 115, as best seen in FIGS. 6A-6C, 15B and 17. Recess 115 may beat least partially defined by a bottom wall 113 and side walls 117,where bottom wall 113 may intersect and/or may be adjacent to fluid path116 of pressure port 110. In some cases, bottom wall 113 may includeand/or define a lip 119 upwardly extending and/or extending towardcarrier 32 when carrier 32 has been attached to pressure port 110. Lip119 may be adjacent to and extend around fluid path 116 of pressure port110, where lip 119 may define an upward end of fluid path 116 ofpressure port 110, as best seen in FIGS. 6A, 6B and 17. Recess 115 ofpressure port 110 may receive a portion of second end 32 b of carrier 32that may extend therein. When second end 32 b has been extended intorecess 115, end face 33 may be situated adjacent bottom wall 113 ofrecess 115, and side walls 35 of carrier 32 may be positioned adjacentto side walls 117 of recess 115, as best seen in FIGS. 6A-6C.

Pressure port 110 may be made out of any material. For example, pressureport 110 may be made out of aluminum, stainless steel, plastic or anyother suitable material. In some cases, at least a portion of a bottomwall 113 of internal side 114 of pressure port 110 may have a texturedsurface or non-textured surface, where the textured surface mayfacilitate adhering pressure port 110 to carrier 32 and may be formedfrom one or more processes including, for example, an abrasive etch,grit blasting, a chemical etch, a laser etch, machining, and/or anyother suitable texturing technique.

As discussed, pressure port 110 and carrier 32 may be assembled to atleast partially form a pressure sensor subassembly 16 (e.g., see FIG.4), where pressure port 110 may be a stainless steel and carrier 32 maybe a ceramic, or pressure port 110 and carrier 32 may be made from othermaterials having similar or different properties. To facilitate theassembly, an adhesive layer 36 or other connection facilitating materialmay be situated in a first plane between end face 33 of carrier 32 andbottom wall 113 of recess 115 (e.g., see FIGS. 6A, 6B, 6C and 17). Endface 33 and bottom wall 113 may be first surfaces of second end 32 b andinterior side 114, respectively, that may be substantially parallel(e.g., two parallel first surfaces). When pressure port 110 and carrier32 are assembled, end face 33 may engage a lip 119 of bottom wall 113,such that lip 119 may define a spacing between end face 33 and bottomwall 113 and as a result, a thickness of adhesive layer 36 between endface 33 and bottom wall 113, as best seen in FIGS. 6A and 6B.Alternatively or in addition, a spacer element 180 may define or helpdefine at least part of a thickness of adhesive layer 36 and/or aspacing between side walls 35 and side walls 117 and/or between secondend face 33 and bottom wall 113 of pressure port 110 (e.g. see FIG. 6B)or at another location. In addition to adhesive layer 36 being disposedin a first plane between end face 33 and bottom wall 113 (e.g., betweentwo substantially parallel or parallel first surfaces), adhesive layer36 may extend up and between side walls 117 of recess 115 and side walls35 of carrier 32 in a second plane at least substantially perpendicularto the first plane (e.g., between two substantially parallel or parallelsecond surfaces at least substantially perpendicular to thesubstantially parallel or parallel first surfaces), as shown in FIG. 6A,for example. In a further instance, when second end 32 b of carrier 32includes a recess 37 in end face 33 (e.g. see FIG. 6B), a bottom wall 39may intersect fluid path 34, and recess 37 may receive at least aportion or part of lip 119 and bottom wall 39 may be spaced from lip 119or may engage lip 119 (not shown). In this illustrative instance,adhesive layer 36 may extend up between side walls 40 of recess 37 andlip 119 extending upward.

In an illustrative example of a pressure sensor subassembly 10, carrier32 may include a second shoulder 41 with protrusion 43 having side walls45, as best seen in FIG. 6C. In this instance, when carrier 32 isassembled with pressure port 110, second shoulder 41 may extend alongand adjacent to bottom wall 113, and protrusion 43 may extend into fluidpath 116 such that fluid path 116, as may be defined by side walls 182,may be in fluid communication with fluid path 34. In this example,adhesive layer 36 may extend between at least side walls 45 and sidewalls 182. In this example and others, alternatively or in addition topressure port 110 including lip 119, one or more of carrier 32 andpressure port 110 may define one or more spacer elements 180, wherespacer elements 180 may define or help define at least part of athickness of adhesive layer 36 between side walls 35 and 117 and/orbetween second shoulder 41 and bottom wall 113 of pressure port 110 orat another location, such as shown in FIG. 6C.

Adhesive layer 36 may be any adhesive capable of facilitating assemblyof subassembly 16, such as an epoxy adhesive or other similar ordifferent adhesives. Illustrative example adhesives may include, but arenot limited to, EP1330 LV available from RESINLAB® having theingredients of at least Bisphenol-A type epoxy resin, Diglycidyl etherof neopentyl glycol, cycloaliphatic/aliphatic amine, aluminum oxide,carbon black, and amorphous silicon dioxide; SUP10HT available fromMasterbond and having the ingredients of epoxy phenol novalac (25%-50%by weight), aluminum powder (10%-25% by weight), flexibilizer epoxyresin (10%-25% by weight), curing agent (2.5%-10% by weight), siloxanetreated silicon dioxide (2.5%-10% by weight), silicon dioxide,chemically prepared (≦2.5% by weight), and curing agent (≦2.5% byweight); and 1469 SCOTCH-WELD available from 3M® and having theingredients of epoxy resin (70%-90% by weight), non-volatile amide(10%-30% by weight) and amorphous silica (1%-5% by weight), or othersuitable adhesives as desired.

Electrical Connector

Pressure sensor assembly 10 may have an electrical connector 120 with abody 121 having a first end 121 a (e.g., adjacent or near sensorinterface 125) and a second end 121 b (e.g., adjacent or near a cableinterface 127), as best seen in FIGS. 13-14B, where body 121 may be madefrom any material. In one example, body 121 may be made from a plasticor metal or another similar or different material, as desired.

Electrical connector 120 may have at least a mechanical connector 124with a first end 124 a and a second end 124 b and two or more electricalterminals 122, as best seen in FIGS. 2 and 5. In one example, two ormore electrical terminals 122 may be exposed at first end 124 a ofmechanical connector 124 (see FIG. 14B) and two or more electricalterminals 122 may be exposed at second end 124 b of mechanical connector124 (see FIG. 14A). Further, one or more of electrical terminal 122 mayface first end 121 a or a sensor interface 125 and one or more ofelectrical terminal 122 may face second end 121 b or cable interface127, where electrical terminals 122 facing second end 121 b and/or cableinterface 127 may be compliant pins 106, as seen in FIGS. 2 and 5.Compliant pins 106 may be connected to connector body 121 in any manner;for example, compliant pins 106 may be insert molded in the electricalconnector body 121. At least one of electrical terminals 122 may beelectrically connected to one or more pressure signal output terminals30 of sensor unit 20 and sensor unit 20 may be mechanically secured tofirst end 121 a or sensor interface 125 of electrical connector body121.

In some instances, electrical connector 120 may include an alignmentfeature 128 for engaging a second alignment feature 152 of outer housing130. Alignment feature 128 may engage or contact corresponding secondalignment feature 152 of outer housing 130 at interior 131 of outerhousing 130, as best depicted in FIG. 13. In addition, and in someinstances, electrical connector 120 may include an external vent 146, asseen in FIGS. 3-5, where vent 146 may extend from outside of aperture136 of outer housing 130 to an interior 131 of aperture 136 of outerhousing 130. Further, and in some instances, electrical connector 120may include an internal vent 184, as seen in FIGS. 5 and 13-14B.Internal vent 184 may extend from inside connector 120 and release intocable harness 160, such that exhausted fluid may be capable of flowingthrough cable 162 to an open atmosphere. As seen in FIG. 5, vents 146,184 are depicted as being closed and the dotted circles adjacent vents146, 184 represent areas of connector 120 where material may be removedto open vents 146, 184. In addition, FIG. 14A depicts internal vent 184in a closed position and a dotted circle is placed between terminals 122to represent a possible position of vent 184 if it were in an openposition.

In some cases, a third PCB 80 (e.g., an electrical connector PCB) ormore PCBs, may be included in pressure sensor assembly 10. In theillustrative example shown, third PCB 80 may be connected to and/orpositioned within electrical connector 120 and may be connected orsecured to electrical connector 120 in any manner at first end 121 a ofelectrical connector body 121. For example, as seen in FIG. 13 (note,for clarity purposes only added features have reference numerals in eachsubsequent step of the flow), an electrical connector may be provided(S10), and in an optional step, potting material 123 may be insertedinto terminal recess 129 (S11). Potting material 123 may be optionallyused to fill or substantially fill recess 129 for any purpose. Forexample, potting material 123 may be inserted in recess 129 wheninternal vent 184 is in a closed position to create an environmentalmoisture seal and to increase the structural stability around terminals122. Further, a filter (not shown) covering external vent 146 at or nearor about ledge 144 interior to first end 121 a of connector body 121 maybe optionally utilized. For example, the filter covering external vent146 may be utilized where vent 146 is open and creates a fluid path froman interior of outer housing 130 and connector body 121 to an exteriorthereof. The filter optionally placed on external vent 146 may be anytype of filter; for example, the filter may be a hydrophobic and/oroleophobic filter and/or the filter may be configured to filter outother non-desirable materials. After optionally adding potting material123 and/or the filter to electrical connector 120, third PCB 80 (S12)may be mechanically secured to electrical connector 120 relative tofirst end 124 a of mechanical connector 124 (S13 and S14). Third PCB 80may be secured to electrical connector 120 through the use of compliantpins 106 or another mechanical connecting technique. In addition, thirdPCB 80 may be in electrical communication with one or more of theelectrical terminals 122 of electrical connector 120. For example, thirdPCB 80 may have one or more terminals 86 electrically connected tocorresponding terminals of the two or more electrical terminals 122exposed at first end 124 a of mechanical connector 124. Further, thirdPCB 80 may be in electrical communication with sense element 52 ofcarrier 32 of sensor unit 20 through one or more of the pressure signaloutput terminals 30. Third PCB 80 may include one or more sensorelectrical terminals 86 configured to connect to sensor unit 20, wheresensor electrical terminals 86 may be located at common locationsrelative to conductive outer housing 130 regardless of which electricalconnector 120 may be utilized (e.g., electrical connectors 120 may takeon various shapes and configurations of which a single electricalconnector 120 may be selected for use in sensor assembly 10).

Third PCB 80 may be a multiple layer printed circuit board that includesa layer (not shown) that is substantially a metal layer (e.g. a groundlayer). The metal layer, which may be a ground layer or may be used forany other purpose, may span across a portion (e.g., a quarter, half,majority, etc.) of third PCB 80 and may provide part of or facilitateproviding, along with outer housing 130 and/or pressure port 110, anElectro Magnetic Interference (EMI) barrier (or a “Faraday cage”) orshield around sensor unit 20. In some cases, circuitry may be providedon third PCB 80 to assist in protecting against EMI, signal noise,and/or Electro-Static Discharge (ESD). For example, third PCB 80 mayinclude one or more filter component, where the one or more filtercomponent may be electrically coupled to at least one of the one or moreterminals 86 of third PCB 80, which are electrically connected tocorresponding terminals 122 that are exposed at first end 124 a ofmechanical connector 124. The filter components may include, forexample, one or more inductors, capacitors, filter capacitors, ESDdiodes and/or any other components suitable for preventing or mitigatingincoming and outgoing noise. Such filter components may be utilized tofilter power signals (e.g. power and ground), pressure output signal(s)and/or any other signals of the pressure sensor.

Outer Housing

Pressure sensor assembly 10 may include outer housing 130, which mayform at least a portion of connector subassembly 14, as seen in FIGS. 4and 5. Outer housing 130 may have an interior 131, an exterior 133, afirst end 130 a and a second end 130 b, where a wall 134 extendingbetween first end 130 a and second end 130 b may define an aperture 136.In the illustrative embodiment shown, outer housing 130 may extendbetween pressure port 110 and electrical connector 120, and may bemechanically secured to mechanical connector 124 and electricallyconnected to the conductive metal layer of third PCB 80, sometimes via awave spring as further described below. In some cases, sensor unit 20may be disposed within a space defined by pressure port 110, electricalconnector 120 and outer housing 130.

Outer housing 130 may be made from any suitable material. In some cases,outer housing 130 may be made out of an electrically conductive oranother material, and outer housing 130 may be electrically connected topressure port 110, as desired. There may be several purposes forutilizing outer housing 130. Those purposes may include, for example,providing or facilitating a Faraday cage or shield around sensor unit20, providing a mechanical or protective shield over the sensor unit 20to help protect the sensor unit from the external environment and/ordebris.

In some instances, and as best depicted in FIG. 5, wall 134 of outerhousing 130 may define a ridge 138 positioned between first end 130 aand second end 130 b of outer housing 130. Ridge 138 may extend inwardinto aperture 136 and may have a first surface 138 a facing or directedgenerally toward first end 130 a and a second surface 138 b facing ordirected generally toward second end 130 b. Wall 134 may define aperture136 such that third PCB 80 and at least a portion or part of mechanicalconnector 124 may extend through first end 130 a of conductive outerhousing 130 and into aperture 136. First surface 138 a of ridge 138 mayact as a stop to stop the insertion of third PCB 80 and mechanicalconnector 124 into aperture 136. Further, an o-ring 148 may bepositioned or inserted on electrical connector 120 at first end 124 a(S15 and S16), as seen in FIG. 13. O-ring 148 may provide a seal betweenmechanical connector 124 of electrical connector 120 and interior 131 ofouter housing 130.

Further, and in some instances, a conductive wave spring 140 may beprovided (S17) and situated or inserted between first surface 138 a ofridge 138 and a conductive region of the third PCB 80 (S17 and S18) soas to electrically connect the outer housing 130 with the ground planeof the third PCB 80, as seen in FIG. 13. Wave spring 140 may be insertedbetween first surface 138 a and third PCB 80 prior to or when slidingelectrical connector 120 into aperture 136 of outer housing 130 or atanother time, such that one or more conductive regions of third PCB 80electrically connect wave spring 140 to the ground layer of the thirdPCB 80. In this construction, wave spring 140 may provide or facilitatean electrical connection between outer housing 130 and the conductiveground layer of third PCB 80. Once wave spring 140 and electricalconnector 120 have been inserted into aperture 136 of outer housing 130(S18), outer housing 130 may be formed (bent) around a shoulder 126 ofmechanical connector 124 (S19). Such a forming step may keep electricalconnector 120 in place between ridge 138 and the formed portion of outerhousing 130 at first end 130 a.

Cable Harness

Pressure sensor assembly 10 may include a cable harness 160, as bestshown in FIGS. 1, 2, 22 and 23. Cable harness 160 may include a cable162 having a first end 162 a and a second end 162 b opposing first end162 a, where cable 162 may include one or more wires 164 extendingbetween first end 162 a and second end 162 b of cable 162. In somecases, cable 162 may also include a cable sleeve 163 that may extendaround wires 164 for at least a portion (e.g., a quarter, a half, amajority, more than a majority, etc) of a length of cable 162.

Cable harness 160 may include a cable cover 166 (e.g., see FIGS. 2 and19-23) having a first end 166 a and a second end 166 b at an opposingend from first end 166 a, with a wall 168 defining cavity 172, wherewall 168 may extend from second end 166 b toward, but possibly not allthe way to, first end 166 a (e.g., see FIGS. 2, 19, 22 and 23). Secondend 166 b of cable cover 166 may be connected or secured, in amechanical or other manner, to second end 121 b or cable interface 127of electrical connector body 121. For example, second end 166 b cablecover 166 may overlap and may be secured to second end 121 b or cableinterface 127 of electrical connector body 121 through forming a jointby heat staking, thermal welding, ultrasonic welding, an adhesive,and/or using any other suitable connecting technique. It is contemplatedthat cable cover 166 may be made from any suitable material; forexample, cable cover 166 may be a plastic or a metal or a similar ordifferent material, as desired.

Cable cover 166 may include one or more rib 167 inside cavity 172 andnear or adjacent to a cable receiving opening 170 that may extend fromfirst end 166 a of cable cover 166 into cavity 172, as best seen inFIGS. 20 and 21. First end 162 a of cable 162 may extend through cablereceiving opening 170 in cable cover 166, and a first end of wires 164may be electrical connected to one or more than one electrical terminals122 facing the second end 121 b of electrical connector body 121.

Cable 162 may be secured within cavity 172 by crimping a crimp ring 174around and to cable 162 at a distance from first end 162 a of cable 162(e.g., see FIGS. 22 and 23) or through another securing technique. Crimpring 174 may be placed around cable sleeve 163 extending through cablereceiving opening 170 of cable cover so as to secure cable sleeve 163 towires 164, as best seen in FIG. 2. Crimp ring 174 may be positioned oncable 162 within cavity 172 and sized so as to not be capable of passingthrough cable receiving opening 170. It is contemplated that crimp ring174 may engage at least one rib 167 inside the cavity 172 of cable cover166 to assist or help prevent cable 162 from rotating relative to cablecover 166.

Cable harness 160 may also include potting holes 175 extending intocavity 172 of cable cover 166, as best shown in FIGS. 19 and 20, throughwhich a potting material 176 (e.g., an electrically non-conductive epoxyliquid material or other non-conductive material capable of being usedto fill a cavity) may be inserted to fill or substantially fill the openspace of cavity 172. Cavity 172 may be filled at anytime; for example,cavity 172 may be filled after second end 166 b of cable cover 166 hasbeen secured, attached or connected to second end 121 b of electricalconnector body 121. Potting material 176 may be used for any purpose;for example, potting material 176 may be used to create an environmentalmoisture seal and/or for structural stability within cable cover 166.

As alluded to, in an illustrative example, cable harness 160 may beassembled by inserting first end 162 a of cable 162 through a cablereceiving opening 170 in cable cover 166. Further, crimp ring 174 may besecured at a distance from first end 162 a of cable 162 such that crimpring 174 may fit within cavity 172, but not through cable receivingopening 170. This may help prevent the first end 162 a of the cable 162from being pulled out of the cable receiving opening 170. The assemblymay include electrically connecting the first end 162 a of cable 162 toone or more electrical terminal 122 of electrical connector 120 andsecuring the second end 166 b of cable cover 166 to second end 121 b ofelectrical connector body 121. After connecting the cable cover 166 andelectrical connector body 121 and making an electrical connectionbetween terminals 122 and first end 162 a of cable 162, cavity 172 ofcable cover 166 may be filled or substantially filled with pottingmaterial 176 through potting holes 175 in cable cover 166 or throughanother opening in cable cover 166. As mentioned, potting material 176may be used to provide an environmental moisture seal and/or to addstructural stability to cover 166 or the structure, in general.

First end 162 a of cable 162 may be connected to one or more electricalterminal 122 through a harness PCB 178 of electrical connector 120,where one or more wires 164 at first end 162 a of cable 162 extendingthrough cable receiving opening 170 may be electrically connected toharness PCB 178, as best seen in FIG. 2. Harness PCB 178 may beelectronically connected to one or more of the electrical terminals 122(e.g., one or more of the compliant pins 106) facing second end 121 b orcable interface 127 of body 121 of electrical connector 120. Electricalterminals 122 facing second end 121 b or cable interface 127 of body 121may include compliant pins 106. Compliant pins 106 facing second end 121b or cable interface 127 may be configured to be inserted throughcorresponding conductive holes in harness PCB 178 to form an electricalconnection with harness PCB 178, as seen in FIG. 2.

Assembly of Sensor Assembly

In one illustrative example, a sensor housing assembly or assemblies 12and two or more sensor unit sub-assemblies 20 may be provided. Where twoor more sensor unit sub-assemblies 20 are offered, sensor units 20 maybe substantially similar. For example, one or more pressure signaloutput terminals 30 of each of the two or more sensor unitsub-assemblies 20 may be provided at the same relative locations onrespective sensor unit sub-assemblies 20 so that an electrical interfaceconnection between the one or more pressure signal output terminal andthe selected electrical terminal 122 of the electrical connector 120 ofthe sensor housing assembly 12 may be the same or substantially similarfor each sensor unit sub-assembly 20. Similarly, pressure input ports 22of the first and second sensor unit sub-assemblies 20 may be provided atsame relative locations on sensor unit sub-assemblies 20 so that apneumatic interface connection between pressure ports 22 of sensor unitsub-assemblies 20 and pressure port 110 of sensor housing assembly 12may be the same or substantially similar. The circuitry on first circuitboards 60 and/or second circuit boards 70 of each sensor unit 20 of thetwo or more sensor units 20, however, may format one or more pressuresignals provided by pressure sense element 52 in at least a firstpredetermined format in a first sensor unit 20 and at least a secondpredetermined format that may be different than the first format in asecond sensor unit 20. Further, the formatting circuitry may be changedper sensor unit 20 by swapping out or changing either or both first PCB60 and second PCB 70 or through other circuit changing techniques. Inaddition, or alternatively, each pressure sensor unit sub-assembly 20may include a same or different sense element 52 or any combination ofdifferent and same sense elements 52. For example, a first sense element52 of a first sub-assembly 20 may be more suited for a first pressurerange and a second sense element 52 of a second sub-assembly 20 may bemore suited for a second pressure range, where the first pressure rangemay includes ranges such as 1.0 PSI-9.0 PSI; 15 PSI-20 PSI, which may beranges that are higher than the second pressure ranges of 0.1 PSI-0.9PSI; 2.0 PSI-8 PSI. These are only examples. In some cases, the pressureranges may be much higher such as 100-500 PSI, 1000-5000 PSI, etc. Also,and in an illustrative embodiment, the sense elements 52 may be selectedfrom absolute pressure sense elements, gauge pressure sense elements, orother pressure sense elements. Example sense elements may include, butare not limited to, those described in U.S. Pat. Nos. 7,503,221;7,493,822; 7,216,547; 7,082,835; 6,923,069; 6,877,380, and U.S. patentapplication publications: 2010/0180688; 2010/0064818; 2010/00184324;2007/0095144; and 2003/0167851, all of which are hereby incorporated byreference.

As noted above, and in some instances, each of at least a first andsecond sensor unit 20 may provide differently formatted pressure outputsignals to one or more selected electrical terminal 122 of electricalconnector 120. Further, and alternatively or in addition, sensor housingassembly 12 may include a third sensor unit sub-assembly 20 that issimilar to first and second sensor unit sub-assemblies 20, however, thecircuitry of the third sub-assembly 20 may format the one or morepressure output signal in a third output format that may be differentfrom the first and second output formats and then transfer that pressureoutput signal in the third output format to selected electricalterminal(s) 122 of electrical connector 120. In these illustrativeexamples, the first output format may be a ratio-metric output formatand the second output format may be a current format, or the firstoutput format may be a ratio-metric output format and the second outputformat may be a digital format, or the first output format may be acurrent output format and the second output format may be a digitalformat or the output formats may be different combinations of formats ordifferent formats.

Assembling a pressure sensor assembly 10 having sensor housing assembly12 comprising pressure port 110, electrical connector 120 and outerhousing 130 may include several selection steps. For example, theassembly may include selections for sensor housing assembly 12 of one ofa plurality of pressure ports 110 (e.g., two or more pressure ports 110)where each of the plurality of pressure ports 110 at interior sides 114have a fluid opening 118 that may be positioned at a common locationacross all of the plurality of pressure ports 110. External sides 112 ofdifferent pressure ports 110 in the plurality of pressure ports 110 mayhave different configurations including, but not limited to, threadingor no threading on the exterior of external sides 112, threading or nothreading on side walls 182 defining fluid path 116 at the externalsides 112, and/or various shapes and sizes of pressure port 110 atexternal sides 112.

In one example, one of a plurality of electrical connectors 120 may beselected for housing assembly 12, where each of the plurality ofelectrical connectors 120 (e.g., two or more electrical connectors 120)may include second end 121 b of body 121 having a different mechanicalshape, size and/or configuration (e.g., dimension, perimeter size,perimeter outline, etc.) than at least one other second end 121 b of theplurality of electrical connectors 120; first end 121 a of body 121having a common mechanical shape (e.g., dimension, perimeter size,perimeter outline, etc.) relative to the plurality of electricalconnectors 120; sensor electrical terminals 86 for connecting to sensorunit 20 of third PCB 80 at common locations relative to conductive outerhousing 130; and two or more electrical terminals 122 extending out offirst end 121 a and second end 121 b of body 121 at common locationsacross all of the plurality of electrical connectors 120. For example,electrical terminals 122 in first end 121 a of the plurality ofelectrical connectors 120 may be located at common locations relative tothe common mechanical shape of first end 121 a.

The assembly may further include selecting one of the plurality ofpressure unit sub-assemblies 20, as discussed above. In some instances,once the parts or devices for pressure sensor assembly 10 have beenselected or at least after selecting sub-assembly 20, sub-assembly 20may be conditioned, calibrated, configured or tested or have otherinitial processing performed thereon prior to final assembly of sensorassembly 10.

Once the parts are selected and, if desired, calibration or testing hasbeen performed on subassembly 20, pressure sensor assembly 10 may beassembled by connecting or assembling the selected pressure port 110,the selected electrical connector 120 and the selected pressure sensorunit subassembly 20, where the connected sensor unit subassembly 20 mayprovide a formatted one or more pressure output signal to the selectedelectrical terminals 122 of connected electrical connector 120. After orbefore connection of the selected parts, the parts may be slid into orpositioned within aperture 136 of outer housing 130 to form pressuresensor assembly 10. Further, once the parts are within outer housing130, conductive outer housing 130 may be secured relative to theselected electrical connector 120 and pressure port 110. Securing outerhousing 130 relative to electrical connector 120 may include forming(e.g., crimping, bending, etc.) outer housing 130 around shoulder 126 ofelectrical connector 120, fastening outer housing 130 to electricalconnector 120 and/or securing by another securing technique. Securingouter housing 130 relative to pressure port 110 may include forming orwelding outer housing 130 around or to pressure port 110 and/or usingany other suitable connection technique to secure housing 130 topressure port 110.

In some cases, no adjustment or calibration of the sensor unitsubassembly 20 is required after final assembly of the pressure sensor10, e.g. after the selected pressure port 110, the selected electricalconnector 120, the outer housing and the selected pressure sensor unitsubassembly 20 are assembled together into a functioning unit. Also, andin some cases, the assembled pressure sensor assembly 10 may have nomechanism (e.g. device, pin and other mechanism) for adjusting and/orcalibrating the sensor unit subassembly 20 after final assembly ofpressure sensor assembly 10.

Having thus described several illustrative embodiments of the presentdisclosure, those of skill in the art will readily appreciate that yetother embodiments may be made and used within the scope of the claimshereto attached. It will be understood that this disclosure is, in manyrespects, only illustrative. Changes may be made in details,particularly in matters of shape, size, and arrangement of parts withoutexceeding the scope of the disclosure. The disclosure's scope is, ofcourse, defined in the language in which the appended claims areexpressed.

What is claimed is:
 1. A pressure sensor unit subassembly forinstallation into a pressure sensor housing, the pressure sensor unitsubassembly comprising: a carrier, wherein the carrier at leastpartially defines a fluid path extending through the carrier and havinga first end and a second end; a pressure sensor die, wherein thepressure sensor die is secured to the carrier over the first end of thefluid path and such that the pressure sensor die is exposed to apressure applied to the fluid path, wherein the pressure sensor die isconfigured to provide an output that is related to the pressure appliedto the fluid path; a printed circuit board, wherein the carrier isdirectly secured to the printed circuit board; and a cover, wherein thecover is secured to the printed circuit board such that a forcetransferred between the cover and the carrier is transferred via theprinted circuit board.
 2. The pressure sensor unit subassembly of claim1, wherein the cover is secured to the printed circuit board and thecircuit board is secured to the carrier such that, when the pressuresensor unit subassembly is subjected to a pressure of 4 pounds persquare inch (PSI) or more applied to the fluid path via an inlet at asecond end of the fluid path, a force transferred between the carrierand the cover via the printed circuit board does not affect the accuracyof the output of the pressure sensor die by more than 1 percent.
 3. Thepressure sensor unit subassembly of claim 1, wherein the cover issecured to the printed circuit board and the circuit board is secured tothe carrier such that, when the pressure sensor unit subassembly issubjected to a pressure of 4 pounds per square inch (PSI) or moreapplied to the fluid path via an inlet at a second end of the fluidpath, a force transferred between the carrier and the cover via theprinted circuit board does not affect the accuracy of the output of thepressure sensor die by more than 0.1 percent.
 4. The pressure sensorunit subassembly of claim 1, wherein the cover is secured to the printedcircuit board and the circuit board is secured to the carrier such that,when the pressure sensor unit subassembly is subjected to a pressure of10 pounds per square inch (PSI) or more applied to the fluid path via aninlet at a second end of the fluid path, a force transferred between thecarrier and the cover via the printed circuit board does not affect theaccuracy of the output of the pressure sensor die by more than 0.1percent.
 5. The pressure sensor unit subassembly of claim 1, wherein thecover includes one or more support features configured to disperse theforce transferred between the cover and the carrier is transferred viathe printed circuit board.
 6. The pressure sensor unit subassembly ofclaim 5, wherein the one or more support features support at least amajority of the perimeter of the printed circuit board as well as alongtwo opposing sides of the carrier.
 7. The pressure sensor unitsubassembly of claim 1, wherein when the pressure sensor unitsubassembly is configured such that when the pressure sensor subassemblyis installed within the pressure sensor housing, the inlet of the fluidpath of the carrier is in fluid communication with a pressure port ofthe pressure sensor housing, and the pressure sensor die is in signalcommunication with an electrical connector of the pressure sensorhousing.
 8. A method for assembling a pressure sensor, the methodcomprising: calibrating a pressure sensor unit subassembly, the pressuresensor unit subassembly comprising: a carrier, wherein the carrier atleast partially defines a fluid path extending through the carrier andhaving a first end and a second end; a pressure sensor die, wherein thepressure sensor die is secured to the carrier over the first end of thefluid path and such that the pressure sensor die is exposed to apressure applied to the fluid path, wherein the pressure sensor die isconfigured to provide an output that is related to the pressure appliedto the fluid path; a printed circuit board, wherein the carrier isdirectly secured to the printed circuit board; and a cover, wherein thecover is secured to the printed circuit board such that a forcetransferred between the cover and the carrier is transferred via theprinted circuit board, the calibrating step comprising: placing an inletof the fluid path in fluid communication with a pressure source, whereinthe inlet is formed by the second end of the fluid path in the carrier;applying a calibrating pressure to the fluid path, wherein thecalibrating pressure is 10 pound per square inch (PSI) or more, whereinplacing the inlet of the fluid path in fluid communication with thepressure source and applying the calibrating pressure to the fluid pathresults in a force transferred between the carrier and the cover via theprinted circuit board, and wherein the force transferred between thecarrier and the cover via the printed circuit board does not affect theaccuracy of the output of the pressure sensor unit subassembly by morethan 1.0 percent; and installing the pressure sensor unit subassembly ina pressure sensor housing after calibrating the pressure sensor unitsubassembly, wherein the pressure sensor housing includes a pressureport in fluid communication with the inlet of the pressure sensor unitsubassembly and an electrical connector in electrical communication withthe pressure sensor unit subassembly.
 9. The method of claim 8, whereinthe force transferred between the carrier and the cover via the printedcircuit board does not affect the accuracy of the output of the pressuresensor unit subassembly by more than 0.1 percent.
 10. A method forassembling a pressure sensor, the method comprising: calibrating apressure sensor unit subassembly, the pressure sensor unit subassemblycomprising: a carrier, wherein the carrier at least partially defines afluid path extending through the carrier and having a first end and asecond end; a pressure sensor die, wherein the pressure sensor die issecured to the carrier over the first end of the fluid path and suchthat the pressure sensor die is exposed to a pressure applied to thefluid path, wherein the pressure sensor die is configured to provide anoutput that is related to the pressure applied to the fluid path; aprinted circuit board, wherein the carrier is directly secured to theprinted circuit board; and a cover, wherein the cover is secured to theprinted circuit board such that a force transferred between the coverand the carrier is transferred via the printed circuit board, thecalibrating step comprising: placing an inlet of the fluid path in fluidcommunication with a pressure source, wherein the inlet is formed by thesecond end of the fluid path in the carrier; applying a calibratingpressure to the fluid path; and installing the pressure sensor unitsubassembly in a pressure sensor housing and an electrical connector inelectrical communication with the pressure sensor unit subassembly aftercalibrating the pressure sensor unit, wherein the pressure sensorhousing includes a pressure port in fluid communication with the inletof the pressure sensor unit subassembly.
 11. The method of claim 10,wherein placing the inlet of the fluid path in fluid communication withthe pressure source and applying the calibrating pressure to the fluidpath results in a force transferred between the carrier and the covervia the printed circuit board, wherein the calibrating pressure is 1pounds per square inch (PSI) or more, and wherein the force transferredbetween the carrier and the cover via the printed circuit board issufficient to hold the inlet, in fluid communication with the pressuresource.
 12. The method of claim 11, wherein the force transferredbetween the carrier and the cover via the printed circuit board does notaffect the accuracy of the pressure sensor unit subassembly by more than1 percent.
 13. The method of claim 10, wherein calibrating pressure is10 pounds per square inch (PSI) or more, and wherein the forcetransferred between the carrier and the cover via the printed circuitboard is sufficient to hold the inlet in fluid communication with thepressure source.
 14. The method of claim 13, wherein the forcetransferred between the carrier and the cover via the printed circuitboard does not affect the accuracy of the pressure sensor unitsubassembly by more than 1 percent.
 15. The method of claim 13, whereinthe force transferred between the carrier and the cover via the printedcircuit board does not affect the accuracy of the pressure sensor unitsubassembly by more than 0.1 percent.
 16. The method of claim 10,wherein installing the pressure sensor unit subassembly in the pressuresensor housing comprises securing a pressure port of the pressure sensorhousing to the pressure sensor unit subassembly such that a fluid pathof the pressure port is in fluid communication with the inlet of thepressure sensor unit subassembly, and placing an electrical connector ofthe pressure sensor housing in electrical communication with one or moreelectrical terminals of the pressure sensor unit subassembly.
 17. Themethod of claim 16, further comprising installing an outer housing thatextends between the electrical connector and the pressure port, andfurther extends around a perimeter of the pressure sensor unitsubassembly.